Bambu Lab Heatbed Sensor Interface Board FAC009 X1C,P1P,P1S,X1E
Bambu Lab Heatbed Sensor Interface Board FAC009 X1C,P1P,P1S,X1E is on backorder and will be shipped as soon as it becomes available in stock.
Na fotografijama proizvoda prikazan je 3D štampač i drugi uređaji sa dodatnim materijalima radi ilustracije upotrebe. Filamenti, rezini i prahovi nisu uključeni u cenu uređaja i kupuju se odvojeno. Pogledajte našu ponudu AzureFilm filamenata, Formlabs rezina i prahova i Bambu Lab delova kako biste kompletirali svoj sistem za 3D štampu.
A printed circuit board that is placed in the back of the heating plate and has 5 connectors.
Installation
More information on replacing the hotplate sensor interface board can be found on the Bambu Lab Wiki .
Package contents
- Heat plate sensor interface board ×1
- Glue ×1
Compatibility
X1 series and P1 series
Product specification
| Materials | Plastic, metal |
| Color | Black |
| Package weight | 0.02 kg |
| Packaging dimensions | 60 × 60 × 30 mm |

